Thermal Management

We have a wide variety of material options for the management of thermal dissipation. These include thermally conductive electrically insulating interface materials, thermally and electrically conductive materials, gap fillers, phase change materials, greases, adhesives and dry bonding tape to name but a few.


The vast majority of our work is custom made to drawing, and we can usually turn around a new part within 2- 3 weeks from receipt of order. We also hold a large number of standard die knife tools from which we can quickly produce common profiles.


Our experienced and knowledgeable technical team will be happy to provide comprehensive advice, guidance and technical support to ensure that our customers achieve the right solution.

Contact Wavetame

Wavetame Technologies Ltd
Hartfield
East Sussex


+44 (0) 1892 771 024

sales@wavetame.com


Office Hours

Monday – Thursday: 09.00 – 17.00
Friday: 09.00 – 12.00
Saturday – Sunday: Closed

Thermal Interface Material

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Phase Change: Kool-Pads® KFL

In applications demanding very low device clamping forces, Wavetame Kool-Pads™ KFL interface materials offer electrically isolating and non-isolating options. Phase change materials require post assembly operations (heat) to reflow the active material and exclude air from the interface.

  • Available in standard and custom cut outlines


  • Polyimide or Aluminium substrate films

Gap Filling: Kool-Pads® KF

For softer more conformable interface materials, ranging from “blue tack” to softened chewing gum consistency, the Wavetame Kool-Pads™ KF family provide a wide range of thermal performance, hardness and thickness options.

  • Available in standard and custom cut outlines


  • Thickness range 0.25 – 5.0 mm


  • Thermal conductivity 1.0 – 6.0 W.mK

Ceramic Insulator Pads: Kool-Pads® ZAO

Aluminium oxide tiles, machined for standard outline packages, to provide high levels of electrical isolation, achieve tracking index requirements and reduce parasitic capacitance effects often encountered with silicone/glass fibre interface pads.

  • Available outlines for TO-220, TO-247, TO-3 and TO-127


  • Can provide creepage level conforming with IEC950 / EN60-95


  • 96% Al2O3 3.0mm thick

Electrically Isolating: Kool-Pads® KTG

The original grease/mica replacement option. Wavetame KTG thermally conductive, electrically isolating thermal pads range offer replacement materials for Warth International Ltd K177, K228, K230, and K381. For Warth K200 please call to discuss.

  • Sheet, standard outline and custom outline available.


  • Pressure sensitive adhesive one side available for assembly aid.


  • Thickness range 0.15 to 0.5mm available


  • Thermal resistance 0.2 to 0.5 °C/W


  • Voltage breakdown up to 5 kV

CM 20

Electrically Conductive: Kool-Pads® CM 20

In applications where package electrical isolation is not an issue and high levels of thermal performance, at a commercially viable cost, is the key factor, CM20 has been a long standing industry favourite. Good planarity between device and heatsink is essential.

  • Available in sheet, standard or custom cut parts.


  • With or without pressure sensitive adhesive one side for assembly aid.


  • Panasonic Pyrolitic material is also available as an alternative to CM20 for even greater thermal performance. Call for details.

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Shielding Insulators: Kool-Pads® Shield KPS

Where an electrically insulating interface pad is required but parasitic capacitance is an issue, Wavetame KPS Kool-pads™ Shields are an effective answer. Copper foil is laminated between options of polyimide, KTG 228, or KTG 230, and permits grounding of the foil, whilst maintaining isolation of the device.



  • Standard outlines available for TO-220, TO-3P, TO-247, TO-3.


  • Custom design service available.

Thermal Management Hardware

BQ

Transistor Insulating Bushes: Kool-Pads® BQ

Many power package outlines, TO-220 as a common example, are often fitted in application via the tab mounting hole and require electrical insulation between the fixing and device. Wavetame transistor BQs offer a moulded nylon or nylon / glass bush that is easily added during the assembly mounting stage to provide effective insulation between the live tab and mounting hardware.

  • Many available options to cover TO-3, TO-220, DO-4, DO-5 and other package forms.


  • Nylon, GF nylon and PTFE material options.

Transistor Mounting Clips: Kool-Pads® TSC

Device packages, like TO-247, TO-220 for example, are often mounted in application using the mounting hole towards the top end of the package. Thermal management performance is improved by exerting the mounting force centrally over the package, thereby avoiding the cantilever effect experienced by clamping at the top end. This is where Wavetame transistor clips are most effective. The spring steel deploys sufficient clamping to optimise thermal conductivity through the interface pad to the heatsink and can be used on packages with or without mounting holes.

  • Available as either threaded fastener attachment (gull wing) or through hole panel clip.


  • Nylon coated for electrical insulation (gull wing only) or zinc coated for corrosion resistance.


  • For package outlines TO-220, TO-247 / 3P, TO-126, TO218